ADHESIVE RESIN COMPOSITION FOR SEMICONDUCTOR, ADHESIVE FILM, DICING DIE BONDING FILM, AND SEMICONDUCTOR DEVICE

摘要

The present invention relates to an adhesive resin composition for semiconductor, the composition containing: a thermoplastic resin with a low moisture absorption rate; an epoxy resin including a biphenyl-based epoxy resin; and a hardener including a phenol resin, the content of the biphenyl-based epoxy resin in solids being 5 wt% to 25 wt%, to an adhesive film comprising a hardened material of the adhesive resin composition for semiconductor, to a dicing die bonding film comprising a base film, an adhesive layer formed on the base film, and a bonding layer formed on the adhesive layer and containing the adhesive resin composition for semiconductor, and to a semiconductor device comprising the adhesive film.