PREPREG FOR PRINTED WIRING BOARD, LAMINATE AND PRINT CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a laminate and a print circuit board having an excellent resin impregnation property or adhesion between a resin and glass cloth, with a low thermal expansion coefficient and excellent heat resistance and insulation reliability.SOLUTION: In a prepreg for a printed wiring board, a thermosetting resin composition including a resin (A) containing an unsaturated maleimide group and a thermosetting resin (B) is impregnated or applied to at least one kind of glass cloth selected from a group composed of S glass, D glass and Q glass treated by a specific phenylamino silane treatment agent so that the content of resin in the prepreg after drying is 20-90 mass%, and then heated and dried to form into a B-stage condition.SELECTED DRAWING: None