发明名称 LED用リードフレーム及び当該LED用リードフレームを用いた半導体装置
摘要 PROBLEM TO BE SOLVED: To provide a lead frame for LED having a high reflectance of light of short wavelength (460 nm or less) in which the reflectance does not decrease like a peak near a wavelength of 350 nm in a spectral reflectance curve, and to provide a semiconductor device using the same.SOLUTION: A lead frame 1A for LED used for mounting an LED element 12 having an emission wavelength of 460 nm or less includes a substrate 2, and a silver plating layer 3 provided at least on a mounting region MA of the substrate 2 for mounting the LED element 12. Crystal particles of silver having a cross sectional area of 1 μmor more occupy 70% or more of the total area of a predetermined cross section in the thickness direction of the silver plating layer 3. In the spectral reflectance curve of the silver plating layer 3, reflectance near a wavelength of 350 nm does not decrease like a peak.
申请公布号 JP5998621(B2) 申请公布日期 2016.09.28
申请号 JP20120108434 申请日期 2012.05.10
申请人 大日本印刷株式会社 发明人 小田 和範;大石 恵;川合 研三郎;鈴木 綱一;内田 泰弘;毒島 伸一郎;橋本 くるみ
分类号 H01L33/62;H01L23/28 主分类号 H01L33/62
代理机构 代理人
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