SYSTEM, APPARATUS, AND METHOD FOR EMBEDDING A DEVICE IN A FACEUP WORKPIECE

摘要

An integrated package may be manufactured in a die (110) face up orientation with a component (140) proximate to the attached die by creating a cavity (130) in the mold compound (120) during fabrication. The cavity is created with an adhesive layer (132) on the bottom to hold a component such that the top surface of the component is co-planar with the top surface of the attached die. This may allow backside grinding to take place that will not damage the component because the top surface alignment between the attached die and the component prevents the depth of the cavity from extending into the portion of the package that is ground away.