Modified cyanate ester group curable resin composition and varnish, prepreg, metal clad laminated board, film, printed circuit board, and multilayered circuit board using the same

摘要

A modified cyanate ester group curable resin composition, and varnishes, prepregs, laminated boards adhered with metal foil, films, printed circuit boards, and multilayered circuit boards using the same, comprising: (A) a cyanate ester group compound (B) a monovalent phenolic group compound (C) a polyphenylene ether resin, (D) a flame retardant not reactive with the cyanate ester group compound, and (E) a metal group reaction catalyst.