发明名称 |
ANISOTROPIC CONDUCTIVE ADHESIVE, PROCESS FOR PRODUCING THE SAME, CONNECTION STRUCTURE, AND PROCESS FOR PRODUCING THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an anisotropic conductive adhesive in which the conductive particles thereof exist in an insulating adhesive composition without aggregating when magnetic powder particles, such as nickel-coated resin particles, are used as the conductive particles of the anisotropic conductive adhesive. <P>SOLUTION: In the anisotropic conductive adhesive having the conductive particles dispersed in the insulating adhesive composition, magnetic powder particles in which at least a portion thereof is made of a magnetic material are used as the conductive particles. In this case, the conductive particles are demagnetized by the time when anisotropic conductive connection is carried out using the anisotropic conductive adhesive. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012017355(A) |
申请公布日期 |
2012.01.26 |
申请号 |
JP20100153825 |
申请日期 |
2010.07.06 |
申请人 |
SONY CHEMICAL & INFORMATION DEVICE CORP |
发明人 |
SAKAMOTO ATSUSHI;KONISHI MISAO |
分类号 |
C09J9/02;C09J7/00;C09J11/04;H01B1/00;H01B1/22;H01B5/16;H01B13/00;H01L21/60;H01R11/01 |
主分类号 |
C09J9/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|