发明名称 POLYIMIDE RESIN, POLYIMIDE FILM, AND POLYIMIDE LAMINATE
摘要 <p>Disclosed is a polyimide resin composed of a repeating unit represented by the formula (1) below, or alternatively a repeating unit represented by the formula (1) below and at least one repeating unit represented by the formula (2) below (wherein X is as defined in the description). [Chemical formula 1] [Chemical formula 2] The polyimide resin is good in thermoplasticity, solubility in solvents and heat resistance, while exhibiting low water absorption and excellent adhesiveness. This polyimide resin is useful as a material for the adhesive layer in a metal-clad laminate which includes an insulating base, a metal layer and an adhesive layer arranged between the insulating base and the metal layer.</p>
申请公布号 WO2006077964(A3) 申请公布日期 2006.12.21
申请号 WO2006JP300844 申请日期 2006.01.20
申请人 MITSUBISHI GAS CHEMICAL COMPANY, INC.;BITO, TSUYOSHI;KIHARA, SHUTA;OISHI, JITSUO 发明人 BITO, TSUYOSHI;KIHARA, SHUTA;OISHI, JITSUO
分类号 C08G73/10;B32B15/08 主分类号 C08G73/10
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