发明名称 |
POLYIMIDE RESIN, POLYIMIDE FILM, AND POLYIMIDE LAMINATE |
摘要 |
<p>Disclosed is a polyimide resin composed of a repeating unit represented by the formula (1) below, or alternatively a repeating unit represented by the formula (1) below and at least one repeating unit represented by the formula (2) below (wherein X is as defined in the description). [Chemical formula 1] [Chemical formula 2] The polyimide resin is good in thermoplasticity, solubility in solvents and heat resistance, while exhibiting low water absorption and excellent adhesiveness. This polyimide resin is useful as a material for the adhesive layer in a metal-clad laminate which includes an insulating base, a metal layer and an adhesive layer arranged between the insulating base and the metal layer.</p> |
申请公布号 |
WO2006077964(A3) |
申请公布日期 |
2006.12.21 |
申请号 |
WO2006JP300844 |
申请日期 |
2006.01.20 |
申请人 |
MITSUBISHI GAS CHEMICAL COMPANY, INC.;BITO, TSUYOSHI;KIHARA, SHUTA;OISHI, JITSUO |
发明人 |
BITO, TSUYOSHI;KIHARA, SHUTA;OISHI, JITSUO |
分类号 |
C08G73/10;B32B15/08 |
主分类号 |
C08G73/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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