发明名称 ORGANIC-INORGANIC PHOTOSENSITIVE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To obtain a photosensitive transparent resin composition that is useful for producing a solid imaging element and an integrated product of electronic component requiring a solder reflow process and has excellent properties of reflow heat resistance of 260&deg;C and UV yellowing resistance, and to provide a plastic micro-lens or an optical element for a liquid crystal polarizing plate, which uses the photosensitive transparent resin composition. <P>SOLUTION: The photosensitive resin composition comprises a resin obtained by subjecting a specific organosilane-containing compound to condensation polymerization in the presence of a catalyst at 40&deg;C to &le;150&deg;C for 0.1-10 hours and an ultraviolet light absorber having an absorption region at 280-380 nm. The method for producing a plastic micro-lens or an optical element for a liquid crystal polarizing plate comprises using the photosensitive resin composition. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008088195(A) 申请公布日期 2008.04.17
申请号 JP20060267034 申请日期 2006.09.29
申请人 ASAHI KASEI ELECTRONICS CO LTD 发明人 KOBAYASHI TAKAAKI
分类号 C08F299/08;G02B3/00;G02F1/1335 主分类号 C08F299/08
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