发明名称 EVAPORATIVE COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an evaporative cooling apparatus, uniformly and efficiently achieving evaporative cooling for the whole of a material to be cooled. SOLUTION: A cooling fluid injection nozzle 16 is provided on the outer periphery of a jacket part 2 of a reaction chamber 1, and connected to a branch pipe 15. A cooling fluid reservoir 3 is provided at the bottom of the jacket part 2. A circulating pump 10 and an ejector 11 are connected to the lower surface of the cooling fluid reservoir 3 through a pipeline 9. The outlet side of the ejector 11 is connected with the jacket part 2 through a pipeline 14. A suction port of the ejector 11 is connected with the jacket part 2 through a pipeline 12. In the case of cooling the reaction chamber 1, a cooling fluid is injected from the cooling fluid injection nozzle 16 into the jacket part 2, thereby supplying the cooling fluid having a predetermined temperature to the whole of the reaction chamber 1 so that evaporative cooling for the reaction chamber 1 can be achieved without unevenness. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008096058(A) 申请公布日期 2008.04.24
申请号 JP20060280252 申请日期 2006.10.13
申请人 TLV CO LTD 发明人 MORII TAKAYUKI
分类号 F25D7/00;F25B19/02 主分类号 F25D7/00
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