发明名称 |
LIGHT EXPOSURE METHOD, AND LIGHT EXPOSURE APPARATUS |
摘要 |
There is provided an EUV exposure apparatus which restrains its optical systems or a mask used therein from being polluted by contaminations generated in its chamber. An energy beam generating source is arranged near a wafer stage set in the chamber of the EUV exposure apparatus to decompose an emission gas generated from a resist painted on the front surface of a wafer by an energy beam. In this manner, lightening mirrors configuring a lightening optical system as one of the optical systems, projection mirrors configuring a projection optical system as another of the optical systems, the mask, and others are protected from being polluted by contaminations. |
申请公布号 |
US2016170309(A1) |
申请公布日期 |
2016.06.16 |
申请号 |
US201615051093 |
申请日期 |
2016.02.23 |
申请人 |
RENESAS ELECTRONICS CORPORATION |
发明人 |
OIZUMI Hiroaki |
分类号 |
G03F7/20 |
主分类号 |
G03F7/20 |
代理机构 |
|
代理人 |
|
主权项 |
1. A light exposure method, the method comprising:
scanning an exposure-receiving object with extreme ultraviolet (EUV) light projected from a mask on which a predetermined pattern is formed, the exposure-receiving object having a surface on which a resist is painted; shifting or stepping the exposure-receiving object; and radiating an energy beam into an optical path space thereby decomposing an emission gas from the resist, wherein the optical path space is located between the exposure-receiving object and an aperture through which the EUV ray passes from the mask, wherein, during the shifting or stepping, the exposure-receiving object is not scanned by the EUV light, wherein the energy beam is radiated into the optical space only during the shifting or stepping of the exposure-receiving object. |
地址 |
Tokyo JP |