发明名称 LIGHT EXPOSURE METHOD, AND LIGHT EXPOSURE APPARATUS
摘要 There is provided an EUV exposure apparatus which restrains its optical systems or a mask used therein from being polluted by contaminations generated in its chamber. An energy beam generating source is arranged near a wafer stage set in the chamber of the EUV exposure apparatus to decompose an emission gas generated from a resist painted on the front surface of a wafer by an energy beam. In this manner, lightening mirrors configuring a lightening optical system as one of the optical systems, projection mirrors configuring a projection optical system as another of the optical systems, the mask, and others are protected from being polluted by contaminations.
申请公布号 US2016170309(A1) 申请公布日期 2016.06.16
申请号 US201615051093 申请日期 2016.02.23
申请人 RENESAS ELECTRONICS CORPORATION 发明人 OIZUMI Hiroaki
分类号 G03F7/20 主分类号 G03F7/20
代理机构 代理人
主权项 1. A light exposure method, the method comprising: scanning an exposure-receiving object with extreme ultraviolet (EUV) light projected from a mask on which a predetermined pattern is formed, the exposure-receiving object having a surface on which a resist is painted; shifting or stepping the exposure-receiving object; and radiating an energy beam into an optical path space thereby decomposing an emission gas from the resist, wherein the optical path space is located between the exposure-receiving object and an aperture through which the EUV ray passes from the mask, wherein, during the shifting or stepping, the exposure-receiving object is not scanned by the EUV light, wherein the energy beam is radiated into the optical space only during the shifting or stepping of the exposure-receiving object.
地址 Tokyo JP