发明名称 Printed circuit board
摘要 A printed circuit board includes a chip capacitor having electrodes and a metal film formed on one or more of the electrodes, an accommodating layer accommodating the chip capacitor inside the accommodating layer, a connection layer formed over the accommodating layer and having a via hole opening extending to the metal film, and a first via hole structure formed in the via hole opening of the connection layer and connected to the metal film on the one or more of the electrodes of the chip capacitor.
申请公布号 US8107253(B2) 申请公布日期 2012.01.31
申请号 US20080034517 申请日期 2008.02.20
申请人 INAGAKI YASUSHI;ASAI MOTOO;WANG DONGDONG;YABASHI HIDEO;SHIRAI SEIJI;IBIDEN CO., LTD. 发明人 INAGAKI YASUSHI;ASAI MOTOO;WANG DONGDONG;YABASHI HIDEO;SHIRAI SEIJI
分类号 H05K1/18;H01L21/48;H01L23/498;H01L23/50;H01L23/64;H01L25/16;H05K1/02;H05K3/46 主分类号 H05K1/18
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