发明名称 レーザ切断加工方法及び装置
摘要 PROBLEM TO BE SOLVED: To provide a laser cutting processing method and a device capable of restraining generation of a rough surface on a laser cutting surface, just after bending a small diameter circular arc part, when including the small diameter circular arc part of a small radius in a passage for executing laser cutting processing of a thick steel plate.SOLUTION: In laser cutting processing of a thick steel plate, assuming a connection position between a straight line part or a bending part and a small diameter circular arc part when viewed in the advancing direction of the laser cutting processing direction as an A position, a connection position between the small diameter circular arc part and the next straight line part or the bending part by passing through the A position as a B position and a position of a predetermined distance in the advancing direction of the laser cutting processing from the B position as a C position, a laser cutting processing speed is controlled at a low speed while holding laser output up to the C position from the A position in the same output to the laser output and the laser cutting processing speed in the laser cutting processing up to the A position, and when executing the laser cutting processing of the small diameter circular arc part, the laser cutting processing is executed by setting a delay difference in an advance position of the laser cutting processing of a work under surface to the advance position of the laser cutting processing in a work upper surface, smaller than a delay difference in the laser cutting processing of the straight line part.
申请公布号 JP5976156(B2) 申请公布日期 2016.08.23
申请号 JP20150082237 申请日期 2015.04.14
申请人 株式会社アマダホールディングス 发明人 増田 健司
分类号 B23K26/38;B23K26/00 主分类号 B23K26/38
代理机构 代理人
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