ACF REJECT DEVICE FOR ACF BONDING APPARATUS

摘要

The present invention relates to an ACF reject device for the smooth ACF attachment of an ACF bonding apparatus. The ACF reject device for an ACF bonding apparatus comprises: a pair of cutters disposed in a moving path of an ACF to cut removed ACF layers before and after each section of the ACF bonded to a panel; a reject header in contact with the removed ACF layers to separate the removed ACF layers from the ACF; and an adhesive tape supply unit for supplying an adhesive tape to the reject header. The removed ACF layers are cut by the pair of cutters and removed from the ACF by the contact with the adhesive tape supplied to the reject header.