Thermal management solution for circuit products

摘要

An apparatus including a cold plate body; a channel module disposed within the cold plate body including a channel body and a plurality of channels projecting through the channel body; and a manifold disposed on the channel module, the manifold including an inlet and an outlet and a first plurality of apertures in fluid communication with the inlet and a second plurality of apertures are in fluid communication with the outlet. A method including introducing a fluid to an integrated cold plate disposed on an integrated circuit device, the integrated cold plate comprising a cold plate body extending about the device, the fluid being introduced into a manifold in fluid communication with a channel module disposed between the manifold and a base plate, the channel module, and including channels to direct the fluid toward the base plate, and collecting the fluid returned to the manifold.

主权项

1. An apparatus comprising: a cold plate body comprising a cap portion having an opening therein, a sidewall portion extending from the cap portion and a shelf portion protruding a distance inward into the opening; a channel module disposed within the cold plate body comprising a channel body and a plurality of laterally disposed fins with a spacing between the fins defining a plurality of channels through the channel body and extending across the channel body; and a manifold disposed on the channel module and disposed a distance within the cold plate body to contact the shelf, the manifold comprising an inlet and an outlet and a plurality of apertures, wherein each of the plurality of apertures is in fluid communication with each of the plurality of channels of the channel module and wherein first ones of the plurality of apertures are in fluid communication with the inlet and second ones of the plurality of apertures are in fluid communication with the outlet.