发明名称 Conductive pattern producing method and its applications
摘要 An improved method of forming an electrode pattern on a substrate is described. The substrate is coated with a first conductive film and subjected to baking. On the first conductive film is then overlied a second conductive film which mends possible fissures of the first conductive film which, besides, would produce open circuits in the pattern.
申请公布号 US2002110637(A1) 申请公布日期 2002.08.15
申请号 US20010995866 申请日期 2001.11.26
申请人 MASE AKIRA 发明人 MASE AKIRA
分类号 H01L21/60;G02F1/13;G02F1/1343;G02F1/1345;H01L21/48;H05K1/09;H05K3/24;(IPC1-7):B05D5/12;B05D5/12;B05D1/36 主分类号 H01L21/60
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