Heat sink assembly for non-planar integrated circuit package

摘要

A heatsink assembly includes a rigid thermally conductive block having a relatively flat unobstructed surface area and a plurality of legs extending beyond and straddling that surface area, and a thermally conductive compliant pad positioned against the surface area. The assembly is adapted to be positioned over a chip package on a circuit board so that the block covers the package and the pad deforms initially to conform to the abutting surface of the package to establish intimate thermal contact between the package and the block. Suitable fasteners secure the block to the circuit board.