| 摘要 |
A leadframe for semiconductor packages. The leadframe includes a die pad, a side rail, a tie bar, and a plurality of leads. The side rail is around the die pad. The tie bar connects the die pad and the side rail. The leads extend from the side rail to close proximity to the die pad. Each lead has a corresponding lead relative to a predetermined center line. A predetermined pair of corresponding leads are substantial asymmetrical with each other in appearance relative to the predetermined center line.
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