发明名称 COOLING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a cooling apparatus capable of reducing a coolant amount. SOLUTION: A secondary circuit 44 of the cooling apparatus 32 is composed by connecting a secondary heat exchange part 46 condensing a secondary coolant, and an evaporator EP arranged below the heat exchange part 46 and evaporating the secondary coolant by a liquid piping 48 and a gas piping 50. In the secondary circuit 44, a natural circulation cycle is formed to send a liquid phase secondary coolant down from the secondary heat exchange part 46 to the evaporator EP via the liquid piping 48, and to communicate a gaseous phase secondary coolant from the evaporator EP to the secondary heat exchange part 46 via the gas piping 50. In an evaporation pipe 52 of the evaporator EP, an inflow end 52a is arranged higher that an outflow end 52b, and it is a downward gradient toward a circulating direction front side of the secondary coolant. A liquid sealing part formed in the secondary heat exchange part 46 acts as resistance pushing the gaseous phase secondary coolant of the evaporation pipe 52 in a circulating direction. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008096085(A) 申请公布日期 2008.04.24
申请号 JP20060281489 申请日期 2006.10.16
申请人 HOSHIZAKI ELECTRIC CO LTD;IKEMOTO YUKINOBU 发明人 SEKI KAZUYOSHI;HIRANO AKIHIKO;KAGA SHINICHI;IKEMOTO YUKINOBU
分类号 F25D17/00;F25B1/00;F25D9/00;F28D15/02 主分类号 F25D17/00
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