发明名称 RESIN-LEAKAGE SENSING METHOD AND APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a resin-leakage sensing method and apparatus which can sense resin leakage into a housing for electronic circuits without cutting an electronic device, etc. SOLUTION: The resin-leakage sensing apparatus 3 comprises a pressure sensor element 30 and a resin-leakage judging device 31. The pressure sensor element 30 senses the pressure in the inside of a cavity 24 for cases. If a resin 5 leaks into upper and lower cases 100n, 100o for circuits, the pressure in the inside of the cavity 24 for cases is reduced temporarily. The resin-leakage judging device 31 judges the generation of a resin leakage when the value of the sensing result of the pressure sensor element 30 becomes smaller than the limiting value of a judging reference. Thereby, the resin leakage into the upper and lower cases 100n, 100o for circuits can be sensed without cutting an acceleration sensor device, etc. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009004449(A) 申请公布日期 2009.01.08
申请号 JP20070161718 申请日期 2007.06.19
申请人 DENSO CORP 发明人 WATANABE TATSUYA;IMOTO MASAHIKO;GOSHIMA YOSHIYA
分类号 H01L21/56 主分类号 H01L21/56
代理机构 代理人
主权项
地址
您可能感兴趣的专利