Epoxy adhesive compositions containing a rubber-modified epoxy resin contain a bisphenol. The bisphenol can be pre-reacted with the rubber-modified epoxy resin to advance the resin. The adhesives are resistant to thermal degradation as can occur in so-called "overbake" conditions, in which the adhesive is heated to high temperatures for prolonged periods of time. In addition, expanded microballoons are included in epoxy structural adhesives to promote a desired fracture mode.
申请公布号
WO2008127923(A3)
申请公布日期
2009.04.23
申请号
WO2008US59696
申请日期
2008.04.09
申请人
DOW GLOBAL TECHNOLOGIES, INC.;EAGLE, GLENN, G.;LUTZ, ANDREAS