| 摘要 |
In a substrate-processing apparatus for performing coating, baking and developing processes on a semiconductor substrate, a first processing block performs a coating process and a developing process. A second processing block is disposed opposite to the first processing block to heat-treat substrates. A main transfer block is disposed between the first and second processing blocks to transfer the substrates. A third processing block is disposed on one side of the main transfer block in a direction perpendicular to an arrangement direction of the first and second processing blocks to adjust a temperature of the substrates. An auxiliary transfer block is disposed adjacent to the second and third processing blocks to transfer the substrates between the second and third processing blocks. Thus, an overload of the main transfer block may be reduced.
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