Microelectromechanical sensor with out-of-plane sensing and process for manufacturing a microelectromechanical sensor

摘要

A microelectromechanical sensor that in one embodiment includes a supporting structure, having a substrate and electrode structures anchored to the substrate; and a sensing mass, movable with respect to the supporting structure so that a distance between the sensing mass and the substrate is variable. The sensing mass is provided with movable electrodes capacitively coupled to the electrode structures. Each electrode structure comprises a first fixed electrode and a second fixed electrode mutually insulated by a dielectric region and arranged in succession in a direction substantially perpendicular to a face of the substrate.

主权项

1. A microelectromechanical sensor comprising:
a supporting structure having a substrate and electrode structures anchored to the substrate, each electrode structure including a first fixed electrode, a second fixed electrode, and a dielectric region, the first fixed electrode and the second fixed electrode being mutually insulated by the dielectric region and arranged in succession in a direction substantially perpendicular to a face of the substrate; and a sensing mass of a continuous and uniform material movable with respect to the supporting structure so that a distance between the sensing mass and the substrate is variable, the sensing mass including movable electrodes capacitively coupled to the electrode structures.