发明名称 BINDING BAND
摘要 PROBLEM TO BE SOLVED: To provide a binding band capable of safely being cut off without using any dedicated tool capable of solving problems in conventional method, as show in Fig.3, that a dedicated tool and a cost therefor were required for safely cutting a binding band used for binding wires such as wire harnesses without giving any damage to the wires.SOLUTION: The binding band has a separation part in a band part near a head part, which is arranged so that the binding band used for bundling wires creates a predetermined gap from wires.SELECTED DRAWING: Figure 1
申请公布号 JP2016131410(A) 申请公布日期 2016.07.21
申请号 JP20150003778 申请日期 2015.01.13
申请人 FUJITSU GENERAL LTD 发明人 HANEDA YASUSHI
分类号 H02G3/30;F16B2/08 主分类号 H02G3/30
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