发明名称 |
CONNECTION METHOD OF CIRCUIT ELEMENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a connection method of circuit elements capable of preventing excessive application of a conductive adhesive.SOLUTION: The connection method of circuit elements includes: applying conductive adhesives S1 and S2 onto pads 11 of a substrate 10; and mounting a circuit element to the substrate 10 by connecting a bump of the circuit element to the pad 11 of the substrate 10. The application of the conductive adhesives S1 and S2 is performed with a nozzle hole 32A of an inkjet head 30.SELECTED DRAWING: Figure 3 |
申请公布号 |
JP2016149488(A) |
申请公布日期 |
2016.08.18 |
申请号 |
JP20150026378 |
申请日期 |
2015.02.13 |
申请人 |
RICOH CO LTD |
发明人 |
SUEMATSU MASASHI |
分类号 |
H01L21/60;C09J5/00;C09J9/02;C09J11/04;C09J11/06;C09J163/00;H05K3/32 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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