发明名称 CONNECTION METHOD OF CIRCUIT ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a connection method of circuit elements capable of preventing excessive application of a conductive adhesive.SOLUTION: The connection method of circuit elements includes: applying conductive adhesives S1 and S2 onto pads 11 of a substrate 10; and mounting a circuit element to the substrate 10 by connecting a bump of the circuit element to the pad 11 of the substrate 10. The application of the conductive adhesives S1 and S2 is performed with a nozzle hole 32A of an inkjet head 30.SELECTED DRAWING: Figure 3
申请公布号 JP2016149488(A) 申请公布日期 2016.08.18
申请号 JP20150026378 申请日期 2015.02.13
申请人 RICOH CO LTD 发明人 SUEMATSU MASASHI
分类号 H01L21/60;C09J5/00;C09J9/02;C09J11/04;C09J11/06;C09J163/00;H05K3/32 主分类号 H01L21/60
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