OPTICAL DIE PACKAGING

摘要

An optical package includes a laser die a photonics die. The laser die generates light and includes a laser facet that emits light. The photonics die modulates light emitted from the facet and includes an internal waveguide optically connected with the facet and one or more standoff contacts, flush contacts, or reduced contacts. The optical package may also include an external waveguide optically connected to the photonics die. The external waveguide may be optically connected to the photonics die prior to electrically connecting the photonics die with an interposer. The standoff contacts extend from a device side of the photonics die beyond the laser die, the flush contacts extend from the device side of the photonics die to be coplanar with the laser die, and the reduced contacts extend from the device side of the photonics short of the laser die.

主权项

1. An optical package comprising:
a laser die that generates light, the laser die comprising a light emitting facet, and; a photonics die that modulates light emitted from the light emitting facet, the photonics die comprising an internal waveguide optically connected with the laser facet and a plurality of standoff contacts.