REUSABLE THERMOPLASTIC THERMAL INTERFACE MATERIALS AND METHODS FOR ESTABLISHING THERMAL JOINTS BETWEEN HEAT SOURCES AND HEAT DISSIPATING/REMOVAL STRUCTURES

摘要

According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat sources and heat dissipating and/or heat removal structures, devices, or components. In exemplary embodiments, a thermal interface material is configured to have an inverse tan delta of at least 1.1 from about room temperature to about 125° C. and/or a bond line thickness predetermined to be at least 1.1 times greater than a largest filler particle size of the thermal interface material.

主权项

1. A reusable thermoplastic thermal interface material for establishing a thermal joint for conducting heat between a heat dissipating/removal structure and a heat source of an electronic device, wherein the reusable thermoplastic thermal interface material is configured to have an inverse tan delta of at least 1.1 from about room temperature to about 125° C.