| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin sealed semiconductor device which is excellent in the reliability of the performance of a semiconductor element. <P>SOLUTION: A resin sealed semiconductor device includes an outer sheath body 14, a lead frame 11 housed in the outer sheath body 14 and having an end part projecting from the outer sheath body 14, and a semiconductor element 12 housed in the outer sheath body 14 and mounted on the lead frame 11. The outer sheath body 14 is formed by a sealing resin containing porous filler 15 which is distributed in a spatially uneven manner. This structure provides the resin sealed semiconductor device which efficiently radiates heat and a method for manufacturing the semiconductor device. <P>COPYRIGHT: (C)2012,JPO&INPIT |
