发明名称 ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an electronic component in which the strength of a lamination body is improved while internal stress is mitigated.SOLUTION: An electronic component comprises: a laminate body 12 in which a plurality of insulator layers containing ferrite ceramic are stacked in a lamination direction; a spiral coil advancing in the lamination direction while moving around, to which a plurality of coil conductor layers 18a to 18h provided on the insulator layers and at least one or more veer hole conductors extending through the insulator layers in the lamination direction are connected. The first pore area rate in a side gap A1 sandwiched between the outer-peripheral side outer edge of an annular trajectory formed by the overlapping coil conductor layers 18a to 18h in a plan view from the lamination direction and the outer edge of the lamination body is 9.0% or more but 20.0% or less. A second pore area rate in a portion A2 sandwiched by two coil conductor layers in the lamination direction is 8.0% or less.SELECTED DRAWING: Figure 3A
申请公布号 JP2016207939(A) 申请公布日期 2016.12.08
申请号 JP20150090710 申请日期 2015.04.27
申请人 MURATA MFG CO LTD 发明人 ONOZAKI NORIMICHI;TACHIBANA KAORU;ODAWARA MITSURU
分类号 H01F17/00;H01F27/02;H01F41/04 主分类号 H01F17/00
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