发明名称 |
METHOD AND COVERING ELEMENT FOR ENCAPSULATING ELECTRONIC COMPONENTS |
摘要 |
The invention relates to a method for encapsulating electronic components mounted on a carrier, such as for instance a lead frame, printed circuit board, substrate, or film, comprising the successive steps of: a) fixing on a carrier a covering element provided with a recess such that the recess receives at least one electronic component, b) injecting a curing moulding material into the recess wherein at least a part of the gases situated in the recess leaves the recess through at least one venting aperture arranged for that purpose in the covering element, and c) curing the moulding material in the recess. The invention also relates to a covering element for performing this method. |
申请公布号 |
WO9845878(A1) |
申请公布日期 |
1998.10.15 |
申请号 |
WO1998NL00194 |
申请日期 |
1998.04.07 |
申请人 |
FICO B.V.;DANNENBERG, JOHANNES, LAMBERTUS, MARTINUS |
发明人 |
DANNENBERG, JOHANNES, LAMBERTUS, MARTINUS |
分类号 |
H01L21/56;H01L23/31;(IPC1-7):H01L21/56 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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