发明名称 |
ADVANCED MULTILAYERED CORELESS SUPPORT STRUCTURE, AND THEIR FABRICATION |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of fabricating a free standing membrane including a via array in a dielectric used as a precursor in the construction of superior electronic support structures. <P>SOLUTION: The method includes stages of: (I) fabricating a membrane including conductive vias in a dielectric environment on a sacrificial carrier, and (II) detaching the membrane from the sacrificial carrier to form a free standing laminated array. A method of fabricating an electronic substrate based on such a membrane including at least the stages of: (I) fabricating a membrane including conduction vias in a dielectric environment on a sacrificial carrier, and (II) detaching of the membrane from the sacrificial carrier to form a free standing laminated array; (V) thinning and planarizing; and (VII) terminating. <P>COPYRIGHT: (C)2008,JPO&INPIT |
申请公布号 |
JP2007324565(A) |
申请公布日期 |
2007.12.13 |
申请号 |
JP20070050798 |
申请日期 |
2007.02.28 |
申请人 |
ADVANCED MULTILAYER INTERCONNECT TECHNOLOGIES LTD |
发明人 |
HURWITZ DROR;IGNER EVA;BORIS STATNIKOV;BENNY MICHAELI;MORDECHAY FARKASH |
分类号 |
H01L23/12;H01L23/32 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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