发明名称 ADVANCED MULTILAYERED CORELESS SUPPORT STRUCTURE, AND THEIR FABRICATION
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of fabricating a free standing membrane including a via array in a dielectric used as a precursor in the construction of superior electronic support structures. <P>SOLUTION: The method includes stages of: (I) fabricating a membrane including conductive vias in a dielectric environment on a sacrificial carrier, and (II) detaching the membrane from the sacrificial carrier to form a free standing laminated array. A method of fabricating an electronic substrate based on such a membrane including at least the stages of: (I) fabricating a membrane including conduction vias in a dielectric environment on a sacrificial carrier, and (II) detaching of the membrane from the sacrificial carrier to form a free standing laminated array; (V) thinning and planarizing; and (VII) terminating. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007324565(A) 申请公布日期 2007.12.13
申请号 JP20070050798 申请日期 2007.02.28
申请人 ADVANCED MULTILAYER INTERCONNECT TECHNOLOGIES LTD 发明人 HURWITZ DROR;IGNER EVA;BORIS STATNIKOV;BENNY MICHAELI;MORDECHAY FARKASH
分类号 H01L23/12;H01L23/32 主分类号 H01L23/12
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