| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photographing apparatus having an assembling structure in which a stress to be applied to a soldering part of a solid-state imaging element on a rigid substrate can be reduced, even if the rigid substrate larger than ever is incorporated in a floating state into the inside of a photographing apparatus. <P>SOLUTION: The rigid substrate 105 is made to be a little larger so that circuit components such as a driving circuit and a front end can be mounted in addition to the solid-state imaging element. An accommodating section 102 is provided in which the solid-state imaging element 104 on the rigid substrate 105 enters into the rear side of a mirror barrel, and the abutment of the solid-state imaging element 104 is received on an internal wall surface to position the solid-state imaging element 104. A spacer 103 is inserted into a portion of the accommodating section 102 sandwiched by the rigid substrate side wall surface and the rigid substrate 105, so that the influence of vibration (shown by an arrow) of an end of the rigid substrate 105 may not appear on a soldering portion P. <P>COPYRIGHT: (C)2008,JPO&INPIT |
