| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a polishing solution for metal having a quick polishing speed, enhancing the planarity and not forming a groove easily between an interconnection and an insulating layer. <P>SOLUTION: The polishing solution for metal contains at least one kind of sulfonic acid compound selected from a group of 1-6C alkyl sulfonic acids and 1-6C alkanol sulfonic acids, and an anionic surfactant. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
