| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a cooling device capable of facilitating process management in an assembly process of the cooling device, reducing heat resistance in an electronic device formed by the assembly process and a cooling member, and restraining a secular change. SOLUTION: A plurality of CNTs 104 are vertically grown from a surface 108 of the cooling member 102. In the growth of the CNTs, although the present invention produces an effect when in-plane density is not less than 20%, the in-plane density should be desirably high as much as possible. The electronic device 106 and the cooling member 102 are arranged nearly oppositely by fastening or the like so that the end of the grown CNT 104 comes into contact. The length of the CNT 104 should be desirably approximately 1-4 times larger than surface roughness Rz of the electronic device 106 to be arranged oppositely. COPYRIGHT: (C)2009,JPO&INPIT
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