| 摘要 |
In an RFID tag including an IC chip for storing information, a thermoplastic resin surrounding the IC chip, and a circuit for transmitting or receiving radio signals bearing the information, the circuit is further fixedly adhered on the thermoplastic resin in a fashion being exposed out of the surface of the thermoplastic resin. Accordingly, a manufacturing process may be used for covering the IC chip mounted and bonded on the plate-likebody with the thermoplastic resin to thereafter form the circuit. It is thus possible to manufacture a thin RFID tag in a simplified manufacturing process.
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