发明名称 |
Elimination of RDL using tape base flip chip on flex for die stacking |
摘要 |
A flexible film interposer for stacking a flip chip semiconductor die onto a second (bottom) semiconductor die, semiconductor devices and stacked die assemblies that incorporate the flexible film interposer, and methods of fabricating the devices and assemblies are provided. The incorporation of the flexible film interposer achieves densely packaged semiconductor devices, without the need for a redistribution layer (RDL).
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申请公布号 |
US8125065(B2) |
申请公布日期 |
2012.02.28 |
申请号 |
US20070714072 |
申请日期 |
2007.03.05 |
申请人 |
LEE TECK KHENG;MICRON TECHNOLOGY, INC. |
发明人 |
LEE TECK KHENG |
分类号 |
H01L23/02;H01L21/44;H01L21/98;H01L23/12;H01L23/13;H01L23/14;H01L23/48;H01L23/498;H01L25/065;H01L29/40;H05K1/00 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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