LIQUID IMMERSION TRANSFER OF ELECTRONICS

摘要

The invention provides a liquid immersion transfer process for applying electronics (10) on a 3D object (20), the process comprising: (i) providing a foil (110) on a solid carrier (120) in a foil provision stage; (ii) providing electronic wiring (130) and an electronic component (140) to the foil (110) in an electronics provision stage, to provide said electronics (10); (iii) removing the solid carrier (120) and arranging the foil (110) on or in a liquid (30) in a liquid application stage; and (iv) transferring the electronics (10) to the 3D object (20) in a transfer stage, as well as a 3D object (20) obtainable by such process.