MANUFACTURING METHOD FOR LIGHT-EMITTING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method for a light-emitting device including a step of removing a part of a sealing layer from a substrate of the light-emitting device, while suppressing the manufacturing cost of the light-emitting device without decreasing the work efficiency.SOLUTION: A lift-off layer 220 where glass transition or phase transition occurs is formed in a first region of the substrate 100 in which a light-emitting portion is formed and from which a sealing film 200 needs to be removed. Next, the sealing film 200 is formed on the substrate 100 and the light-emitting portion. Next, the lift-off layer 220 is heated up to or above the glass transition temperature or the phase transition temperature of the lift-off layer 220 and then cooled. This produces a crack 202 in the sealing film 200. After that, the lift-off layer 220 and the sealing film 200 located on the lift-off layer 220 are removed.SELECTED DRAWING: Figure 6