CO-MOLDED CERAMIC AND POLYMER STRUCTURE

摘要

A method of manufacturing a co-molded housing component for an electronic device is disclosed. A component formed from a ceramic material is placed in a mold. The mold comprises a first section defining a first cavity configured to receive the first component, and a second section defining a second cavity that is in communication with the first cavity when the mold is closed. The second cavity is in the shape of a feature that is to be joined to the ceramic material. A polymer material is injected into the second cavity, thereby forming the feature from the polymer material and bonding the feature to the ceramic material. The polymer material is cured. The first component and the feature together form the housing component for an electronic device.

主权项

1. A housing component for an electronic device, comprising:
a ceramic shell comprising a central surface surrounded by a flange extending away from the central surface, the central surface and the flange defining a cavity; and a polymer material coating the central surface and the flange; wherein the polymer material is bonded to the central surface and to the flange without any adhesive between the polymer material and the ceramic shell.