| 发明名称 |
METHOD AND APPARATUS FOR ANALYZING SHAPE OF WAFER |
| 摘要 |
A method for analyzing the shape of a wafer according to an embodiment comprises the steps of: acquiring a sectional image showing a wafer to be analyzed; finding a coordinate row of the surface contour of the wafer in the sectional image; and obtaining shape analysis data, including information about the shape of the wafer, using the coordinate row. |
| 申请公布号 |
US2016314577(A1) |
申请公布日期 |
2016.10.27 |
| 申请号 |
US201415105240 |
申请日期 |
2014.06.25 |
| 申请人 |
LG SILTRON INCOROPORATED |
发明人 |
LEE Jae Hyeong;Kim Ja Young |
| 分类号 |
G06T7/00 |
主分类号 |
G06T7/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of analyzing a shape of a wafer, the method comprising:
acquiring a sectional image showing a wafer to be analyzed; finding a series of coordinates of a surface contour of the wafer in the sectional image; and obtaining shape analysis data including information on a shape of the wafer using the series of coordinates. |
| 地址 |
Gumi-si KR |
