| 发明名称 |
PACKAGE MODULE |
| 摘要 |
A package module includes a circuit board, an electronic component disposed on the circuit board, a frame disposed next to at least one side of the electronic component, and an encapsulant. A gap is formed between the frame and the electronic component. The encapsulant includes a first portion covering at least a part of the circuit board, and a second portion filling into at least a part of the gap. The first portion has a first height relative to the circuit board, and the second portion has a second height relative to the circuit board, in which the second height is greater than the first height. |
| 申请公布号 |
US2016374223(A1) |
申请公布日期 |
2016.12.22 |
| 申请号 |
US201615067146 |
申请日期 |
2016.03.10 |
| 申请人 |
Delta Electronics (Shanghai) Co., Ltd. |
发明人 |
XU Hai-Bin;WANG Tao;HONG Shou-Yu;ZHAO Zhen-Qing |
| 分类号 |
H05K7/14;H05K3/30;H05K1/18 |
主分类号 |
H05K7/14 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package module, comprising:
a circuit board; an electronic component disposed on the circuit board; a frame disposed next to at least one side of the electronic component, wherein a gap is formed between the frame and the electronic component; and an encapsulant comprising a first portion covering at least a part of the circuit board and a second portion filling into at least a part of the gap, the first portion being connected to the second portion, the first portion having a first height relative to the circuit board, the second portion having a second height relative to the circuit board, wherein the second height is greater than the first height. |
| 地址 |
Shanghai CN |
