发明名称 |
Semiconductor assemblies with reinforced peripheral regions |
摘要 |
A semiconductor chip assembly with a compliant layer overlying the chip and a flexible dielectric layer overlying the compliant layer. Connecting terminals are provided on the dielectric layer for connection to a larger substrate. The connecting terminals are moveable in vertical directions toward the chip. Bonding terminals, electrically connected to the connecting terminals, are also provided on the top layer. A reinforcing element resists vertical movement of the bonding terminals, and thereby facilitates connection of leads between the bonding terminals and the chip.
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申请公布号 |
US6157075(A) |
申请公布日期 |
2000.12.05 |
申请号 |
US19990384796 |
申请日期 |
1999.08.27 |
申请人 |
TESSERA, INC. |
发明人 |
KARAVAKIS, KONSTANTINE;FJELSTAD, JOSEPH |
分类号 |
H01L23/00;H01L23/31;H01L23/485;H01L23/498;(IPC1-7):H01L23/02;H01L23/495;H01L23/48 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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