| 摘要 |
PROBLEM TO BE SOLVED: To provide a component transfer device capable of adequately disposing an electronic component to a socket, by occasionally reflecting mechanical distortions or expansion or contraction due to heat, and to provide an IC handler. SOLUTION: This IC handler 10 comprises an IC chip T held by a measurement robot 22 on each of shuttles 16, 17, each of shuttle cameras 37, 38 capable of capturing a hand mark to form a single image for a device recognition process; and an image-capture device 40, including a chamber camera capable of capturing socket mark and an inspection socket for forming a single image for a socket recognition process and capturing the socket mark and the hand mark, to form a single image for a mark position recognition process. Each image data for the device recognition process, the socket recognition process and the mark position recognition process is subjected to image processing for obtaining respective relative coordinates of the inspection socket and the hand mark, with respect to the socket mark and a relative coordinate of the IC chip T with respect to the hand mark. Positional correction for mounting the IC chip T on the inspection socket is carried out, according to the respective relative coordinates. COPYRIGHT: (C)2009,JPO&INPIT
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