| 摘要 |
For estimating temperatures of LEDs of a matrix, a model. is used. For each LED, the model comprises: - a first node (110x,y) representing the LED; - a first capacitive component (131) connected to said first node, representing heat capacitance of the LED; - a second node (103x,y) representing a backplate portion corresponding with the LED; - a second capacitive component (132) connected to said second node, representing heat capacitance of said backplate portion; - a resistive component ' (145) between said two nodes, representing heat resistance of a thermal coupling between the LED and the backplate; - resistive components (141, 142, 143, 144) between said second node (103x,y) and adjacent second nodes, representing heat resistances of thermal couplings between the backplate portion and adjacent backplate portions; - a first flow source component (153) connected to said first node, representing heat dissipation of the LED. |
