Semiconductor package and method for manufacturing the same

摘要

A semiconductor package may include an interposer; a first semiconductor chip disposed on a first surface of the interposer and at least one second semiconductor chip disposed at a predefined distance from the first semiconductor chip, a molding part filling spaces between the first semiconductor chip and the at least one second semiconductor chip and having a trench hole formed therein, and a thermal expansion buffer pattern filling the trench hole.

主权项

1. A semiconductor package comprising:
an interposer having a first surface and a second surface that oppose each other; a first semiconductor chip disposed on the first surface of the interposer and at least one second semiconductor chip disposed on the first surface and at a predefined distance from the first semiconductor chip; a molding part filling spaces between the first semiconductor chip and the at least one second semiconductor chip and having a plurality of trench holes formed therein, wherein the trench holes comprise a plurality of first trench holes and a plurality of second trench holes, the plurality of first trench holes extend in a substantially horizontal direction with respect to the first surface of the interposer and the second trench holes extend in a substantially vertical direction with respect to the first surface of the interposer wherein the plurality of second trench holes cross the first trench holes; and a thermal expansion buffer pattern filling the trench holes, wherein the thermal expansion buffer pattern contracts or expands when the temperature of the interposer is changed, thereby the stress applied to the molding part is released.