| 摘要 |
An electronic component includes an electronic component element electrically and mechanically joined to a base member, a plurality of electrode pads of the electronic component element and corresponding electrode lands of the base member being respectively joined together via bumps such that the electronic component element is arranged opposite to the base member. The bumps located along the peripheral portion of the electronic component element have a greater height than that of the bumps located at the central portion of the electronic component element.
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