| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a small size circuit device which is excellent in heat radiation. <P>SOLUTION: In a hybrid integrated circuit device 10 of the invention, a lead 18 and a lead 20 are fastened on an upper surface of the circuit board 12. The lead 18 includes an island part 28, a sloping part 30, and a lead part 32, and a transistor 22 and a diode 24 are mounted on an upper surface of the island part 28. Electrodes provided on upper surfaces of the transistor 22 and the diode 24 are connected to a bonding part 34 via thin metallic wires 26. The bonding part 34 of the lead 18 is positioned higher than the island part 28, and this positioning separates the thin metal wires 26 connecting to the bonding part 34 from each other. <P>COPYRIGHT: (C)2012,JPO&INPIT |
