发明名称 SUBSTRATE PROCESSING APPARATUS WITH MULTI-SPEED DRYING
摘要 After a substrate is cleaned, a liquid supply nozzle moves outward from above the center of the substrate while discharging a rinse liquid with the substrate rotated. In this case, a drying region where no rinse liquid exists expands on the substrate. When the liquid supply nozzle moves to above a peripheral portion of the substrate, the rotational speed of the substrate is reduced. The movement speed of the liquid supply nozzle is maintained as it is. Thereafter, the discharge of the rinse liquid is stopped while the liquid supply nozzle moves outward from the substrate. Thus, the drying region spreads over the whole substrate so that the substrate is dried.
申请公布号 US2009073394(A1) 申请公布日期 2009.03.19
申请号 US20080208925 申请日期 2008.09.11
申请人 SOKUDO CO., LTD. 发明人 MIYAGI TADASHI;KANAOKA MASASHI;SHIGEMORI KAZUHITO;YASUDA SHUICHI;SANADA MASAKAZU
分类号 G03B27/32;B08B13/00 主分类号 G03B27/32
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