Encapsulant module with opaque coating

摘要

The invention provides an encapsulant module for an image sensor device. The module includes an outer frame, a set of optical elements, and an opaque coating. The outer frame includes an enclosing wall and a first opening surrounded by the enclosing wall. The set of optical elements connects to and is disposed in the enclosing wall. The opaque coating overlies the enclosing wall.

主权项

1. An encapsulant module for an image sensor device, comprising:
an outer frame comprising an enclosing wall and a first opening open to an exterior of the encapsulant module surrounded by the enclosing wall; a set of lenses directly connecting to the enclosing wall and configured with an aperture module; an opaque coating overlying the enclosing wall and the aperture module, wherein the opaque coating comprises a coating opening aligned with an aperture opening of the aperture module such that the opaque coating shields parts of regions over the set of lenses; and a flat transparent substrate, between the set of lenses and the first opening, wherein the footprint of the transparent substrate is substantially the same as that of the set of lenses.