| 摘要 |
PURPOSE: An LED package with a heat dissipation structure and a manufacturing method thereof are provided to improve the heat dissipation of an LED package module by mounting a plurality of LED packages with a heat dissipation structure on a PCB. CONSTITUTION: A first thick film copper plate(101) includes at least one groove on the upper side thereof. A thermosetting resin layer(103) is formed on one side of the first thick film copper plate. A second thick film copper plate(102) is formed on one side of the thermosetting resin layer. An insulation layer(104) is formed on a part of the lower surface of the first thick film copper plate and the lower surface of the second thick film copper plate. One or more LED chips(107) are formed in the groove of the first thick film copper plate. |
