MEMBER, MANUFACTURING METHOD OF SAID MEMBER, AND ELECTRONIC COMPONENT PROVIDED WITH SAID MEMBER

摘要

This member is provided with a resin substrate obtained by injection molding using a general resin-containing material that is not a resin-containing material including a soluble filler and a substance serving as a catalyst nucleus, and this member, provided with a conducting layer, is characterized by being provided with a substrate obtained from a molded product of the resin-containing material and having a thin portion of thickness 0.3 mm or less, and with a conducting layer formed on the surface of the thin portion.